Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive

Chunfu Chen; Bin Li; Masao Kanari; Daoqiang Lu

doi:doi:10.11648/j.am.20190802.16

| Peer-Reviewed

Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive

Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu

Published in Advances in Materials (Volume 8, Issue 2)

Received: 3 April 2019 Accepted: 23 May 2019 Published: 29 June 2019

Views: Downloads:

Download PDF

Share This Article

Twitter
Linked In
Facebook

Abstract

A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.

Published in	Advances in Materials (Volume 8, Issue 2)
DOI	10.11648/j.am.20190802.16
Page(s)	94-99
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2019. Published by Science Publishing Group

Keywords

Epoxy, Adhesive, One Component, Thermal Cure, DSC, Pot Life, Shelf Life, Curability, Stability, Crystallization Temperature

References

[1]	T. M. Groulding (2003), In Handbook of Adhesive Technology, 2nd Ed.; A. Pizzi, K. L. Mittal, Eds.; Marcel Dekker, 809-824.
[2]	E. Sancaktar, L. Bai (2001), Polymers, 3, 27-466.
[3]	C. Severijin, S. T. Freitas, J. A. Poulis (2017), Int. J. Adhes. Adhes., 75, 155-164.
[4]	A. Zotti, S. Zuppolini, M. Zarrelli, A. Borriello (2016), In Adhesives-Applications and Properties, InTech, 237-269.
[5]	T. Vidil, F. Tournilhac, S. Musso, A. Robisson, L. Leibler (2016), Prog. Polym. Sci., 62, 126-179.
[6]	X. Liu, C. Zhao, A. Sudo, T. Endo (2013), J. Polym. Sci. Part A: Polym. Chem. 2013, 51, 3470-3476.
[7]	G. Rabilloud (1997), In High Performance Polymers, Editions Technip, 143.
[8]	C. F. Chen (2008), Japan Patent 4204814.
[9]	C. F. Chen, S. Iwasaki, M. Kanari, B. Li, C. Wang, D. Q. Lu (2017), IOP Conf. Ser.: Mater. Sci. Eng., 213, 012032.
[10]	N. Poisson, A. Maazouz, H. Sautereau, M. Taha, X. Gambert (1998), J. Appl. Polym. Sci., 69, 2487-2497.
[11]	K. Shiraishi (2001), Polym. Dig., 53 (6), 65-68.
[12]	D. Lei, W. Ma, L. Wang, D. Zhang (2015), J. Appl. Polym. Sci., 42563.
[13]	T. Hasekawa, M. Kobayashi (2017), Japan Patent 2017-82219A.
[14]	K. Arimitsu, S. Fuse, K. Kudo, M. Furutani (2015), Mater. Lett., 161, 408-410.
[15]	K. Kudo, S. Fuse, M. Furutani, K. Arimitsu (2016), J. Polym. Sci. Part A: Polym. Chem., 54, 2680-2688.
[16]	G. S. Kal, G. A. Vedage, S. M. Boyce, D. N. Shah, A. H. Abdourazak (2014), US Patent 20140303342A.
[17]	J. Wang, Y. Z. Xu, Y. F. Fu, X. D. Liu (2016), Scientific Reports, 6, 38584.
[18]	C. F. Chen, B. Li, C. Wang, S. Iwasaki, M. Kanari, D. Q. Lu (2018), Baekeland 2018, The 6th International Symposium on Network Polymers, Shanghai.
[19]	W. Chen, P. Li, Y. Yu, X. Yang (2008), J. Appl. Polym. Sci., 107, 1493-1499.
[20]	A. D. Rogers, P. Lee-Sullivan (2003), Polym. Eng. Sci., 43 (1), 14-24.
[21]	M. Hayaty, M. H. Beheshy, M. Esfandeh (2011), Polym. Adv. Technol., 22, 1001^1006.
[22]	S. Vyazovkin, N. Sbirrazzuoli (1996), Macromolecules, 29, 1867-1873.
[23]	J. Macan, I. Brnardic, M. Ivankovic, H. J. Mencer (2005), J. Therm. Ana. Calor., 81, 369-373.
[24]	S. Park, M. Seo, J. Lee (2000), J. Polym. Sci. Part A: Polym. Chem., 38, 2945-2956.
[25]	L. Feng, Y. Wang, Y. Wang, H. Liu, J. Zhao (2013), J. Appl. Polym. Sci., 1895-1990.
[26]	D. E. Lee, H. W. Kim, B. S. Kong, H. O. Choi (2017), J. Appl. Polym. Sci., 45252.
[27]	A. A. A. Razak, N. J. Saleh (2016), Eng. & Tech. Journal, 34 (9), 1731.
[28]	R. Nurhayati, E. Rahayu NH, A. Susanto, Y. Khasanah (2017), IOP Conf. Ser.: Mater. Sci. Eng., 193, 012025.
[29]	I. Blanco (2018), Materials, 11, 1383.
[30]	A. Bernath, L. Karger, F. Henning (2016), Polymers, 8, 390.

Cite This Article

Plain Text BibTeX RIS

APA Style

Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. (2019). Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Advances in Materials, 8(2), 94-99. https://doi.org/10.11648/j.am.20190802.16

Copy | Download

ACS Style

Chunfu Chen; Bin Li; Masao Kanari; Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv. Mater. 2019, 8(2), 94-99. doi: 10.11648/j.am.20190802.16

Copy | Download

AMA Style

Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv Mater. 2019;8(2):94-99. doi: 10.11648/j.am.20190802.16

Copy | Download

@article{10.11648/j.am.20190802.16,
  author = {Chunfu Chen and Bin Li and Masao Kanari and Daoqiang Lu},
  title = {Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive},
  journal = {Advances in Materials},
  volume = {8},
  number = {2},
  pages = {94-99},
  doi = {10.11648/j.am.20190802.16},
  url = {https://doi.org/10.11648/j.am.20190802.16},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20190802.16},
  abstract = {A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.},
 year = {2019}
}

Copy | Download

TY  - JOUR
T1  - Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive
AU  - Chunfu Chen
AU  - Bin Li
AU  - Masao Kanari
AU  - Daoqiang Lu
Y1  - 2019/06/29
PY  - 2019
N1  - https://doi.org/10.11648/j.am.20190802.16
DO  - 10.11648/j.am.20190802.16
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 94
EP  - 99
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20190802.16
AB  - A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.
VL  - 8
IS  - 2
ER  -

Copy | Download

Author Information

Chunfu Chen

Henkel Technology Center-Asia Pacific, Henkel Japan Ltd, Yokohama, Japan
Bin Li

Henkel Adhesive Innovation Center, Henkel (China) Co, Ltd, Shanghai, China
Masao Kanari

Henkel Technology Center-Asia Pacific, Henkel Japan Ltd, Yokohama, Japan
Daoqiang Lu

Henkel Adhesive Innovation Center, Henkel (China) Co, Ltd, Shanghai, China

Download PDF

Sections

Plain Text BibTeX RIS

APA Style

Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. (2019). Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Advances in Materials, 8(2), 94-99. https://doi.org/10.11648/j.am.20190802.16

Copy | Download

ACS Style

Chunfu Chen; Bin Li; Masao Kanari; Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv. Mater. 2019, 8(2), 94-99. doi: 10.11648/j.am.20190802.16

Copy | Download

AMA Style

Chunfu Chen, Bin Li, Masao Kanari, Daoqiang Lu. Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive. Adv Mater. 2019;8(2):94-99. doi: 10.11648/j.am.20190802.16

Copy | Download

@article{10.11648/j.am.20190802.16,
  author = {Chunfu Chen and Bin Li and Masao Kanari and Daoqiang Lu},
  title = {Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive},
  journal = {Advances in Materials},
  volume = {8},
  number = {2},
  pages = {94-99},
  doi = {10.11648/j.am.20190802.16},
  url = {https://doi.org/10.11648/j.am.20190802.16},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20190802.16},
  abstract = {A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.},
 year = {2019}
}

Copy | Download

TY  - JOUR
T1  - Curability, Workability and Stability Investigation on a Novel Pure Liquid One Component Thermal Curable Epoxy Adhesive
AU  - Chunfu Chen
AU  - Bin Li
AU  - Masao Kanari
AU  - Daoqiang Lu
Y1  - 2019/06/29
PY  - 2019
N1  - https://doi.org/10.11648/j.am.20190802.16
DO  - 10.11648/j.am.20190802.16
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 94
EP  - 99
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20190802.16
AB  - A novel one component thermal curable epoxy adhesive composed of all liquid reactive ingredients was developed recently. Its thermal cure behavior was measured and analyzed with differential scanning calorimetry isothermal method. Workability and pot life at room temperature as well as storage stability and shelf life under chilled, frozen conditions were measured and analyzed by monitoring its viscosity change during the storage period. The measurement results confirmed that the novel one component epoxy adhesive can cure well at relatively low temperature and its pot life is much longer than conventional two component epoxy adhesives with similar curability and adhesion performance. The novel one component epoxy adhesive was also confirmed to be very stable and its shelf life can be several years long under suitable frozen storage. Based on cure behavior measurement results, cure kinetics of the novel one component epoxy adhesive was investigated. Arrhenius equation obtained from kinetics plot curve was applied to predict pot life and shelf life and it was found that the predicted pot life and shelf life correlate very well with actual measured results. Crystallization temperature of the novel epoxy adhesive was also measured and found to have close relationship with storage stability. This study verified that differential scanning calorimetry isothermal method can be used to predict shelf life of one component epoxy products. In addition, crystallization temperature measurement can be utilized for better stable epoxy adhesive development and suitable storage temperature determination.
VL  - 8
IS  - 2
ER  -

Copy | Download